Resin composition for printed circuit board
US4943606A · kind A · utility
36Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1988 |
| Grant date | Jul 24, 1990 |
| Priority date | — |
| Expiry date | Aug 26, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0251
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for printed circuit board comprising: PA0 (A) 30-90% by weight of a liquid crystal polyester, PA0 (B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 .mu.m or below and an average length of 200 .mu.m or below, and PA0 (C) 3-30% by weight of an alkaline earth metal carbonate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.