Adhesive copolyamide composition based on phenylene containing diamine
US4943625A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1988 |
| Grant date | Jul 24, 1990 |
| Priority date | — |
| Expiry date | Sep 7, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive copolyamide composition having a dry powder DSC melting point of at least 100.degree. C., a glass transition temperature above 60.degree. C., a dry powder softening point of at least 100.degree. C., preferably a water content after storage in water of more than 20% by weight, and a wet softening point of less than 100.degree.. Such compositions exhibit softening points and heat resistances in excess of 100.degree. C. and can be processed and set at substantially lower temperatures. No low molecular weight additives are required nor are any solvents necessary. The compositions are comparable in their heat-resistance, softening points, and bond strength to conventional high performance hot melt adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.