Method for electroless plating of ultrafine or colloidal particles and products produced thereby
US4944985A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1988 |
| Grant date | Jul 31, 1990 |
| Priority date | — |
| Expiry date | Apr 11, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2993
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a process for the electroless plating of easily reducible metals onto ultrafine, usually inert, particles. Such plating is achieved through careful and accurate control of such parameters as the feed rates of the various solutions, the control of pH of the solution, the temperature, pressure and the rate of agitation of the solution in which the plating is taking place. The plated ultrafine composite particles and the powders made from the particles produced by the process are also a part of the invention. There is also provided a metal article of manufacture consisting of a metla such as copper, silver, gold, ruthenium, rhodium, palladium, osmium and platinum with a plurality of shperical shaped ultrafine particles with a diameter of less than about 10 microns dispersed substantially evenly through the metal article. The articles are fabricated using the plated ultrafine composite powders by methods involving, such as for example, casting, powder metallurgy and mechanical compression. The ultrafine particle is most generally of an inert material. There is also provided a process for making cast articles and recastable mixtures using the plated compos…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.