Subassembly for optoelectronic devices
US4945400A · kind A · utility
82Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1989 |
| Grant date | Jul 31, 1990 |
| Priority date | — |
| Expiry date | Oct 30, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4231
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.