Method of producing semiconductor devices
US4946633A · kind A · utility
12Cited by
0References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1988 |
| Grant date | Aug 7, 1990 |
| Priority date | — |
| Expiry date | Apr 22, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/812
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus for producing semiconductor devices is provided with mold and lead frame suitable for improving the production efficiency and product quality. Also disclosed is a method of producing semiconductor devices by means of the apparatus. The mold is characterized by the shape of a die and has a plurality of pots for pressure-feeding resin, a flow passage communicating the pots with each other so as to uniformalize the molding pressure applied to the pots even if there are variations in the weights of the resin charged in the pots, and a plurality of cavities disposed in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.