Electric carrier devices and methods of manufacture
US4946733A · kind A · utility
13Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1988 |
| Grant date | Aug 7, 1990 |
| Priority date | — |
| Expiry date | Jul 21, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.