Patent · US Expired

Positive type 1,2 quinone diazide containing photosensitive resinous composition with acrylic copolymer resin

US4946757A · kind A · utility

5Cited by
6References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 27, 1988
Grant dateAug 7, 1990
Priority date
Expiry dateOct 27, 2008

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/0233
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The invention provides a photosensitive resin composition specifically useful for microfabrication resist films and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion, and moreover, when developed, non-exposed parts being of extremely less swelling nature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.