Epoxy resin composition
US4948449A · kind A · utility
12Cited by
23References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1989 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Feb 21, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Storage-stable, thermally-curable, one-part epoxy resin compositions comprising a curable epoxide resin; a curative amount of an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of said polyol being primary or secondary, and said polyol being free of strong acid groups, and free of electron-withdrawing substituents and large groups which cause steric hindrance in the .alpha.-position in relation to the carbon atoms attached to the methylol groups of the polyol; and a catalytic amount of an imidazole compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.