Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4948483A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 1989 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Aug 16, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improvement in an electroplating apparatus which has a conveyor arrangement which conveys a workpiece through an electrolyte bath with an edge portion of each of the workpieces extending laterally out of the bath in a sealed relationship and being engaged by a contact arrangement characterized by the contact arrangement being constructed as an endlessly moving belt having either brushes or contact spring pairs for engaging the edge of the workpiece. In addition, the belt is arranged to move over two pulleys to provide a run adjacent the edge and a return run which passes through a cleaning arrangement which is an electrolytic demetallization cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.