Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4948486A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 1989 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Aug 16, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus for plate-shaped workpieces which are conveyed in a horizontal path through an electrolytic cell characterized by the edges of the workpieces being grasped via contact elements that are secured on an endless circular flexible metal band. The side face of the metal band facing toward the workpiece glides above and below the conveyor and contact elements on guide and seal elements that extend in the wall of the cell along the horizontal direction. The metal band and conveyor and contact elements simultaneously have the job of conveying the workpiece, of cathodic contacting of the workpiece and of sealing an electroplating cell against the emergence of electrolyte solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.