Three step process for treating plastics with alkaline permanganate solutions
US4948630A · kind A · utility
18Cited by
24References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1989 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Mar 14, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.