Liquid light-sensitive resinous composition
US4948700A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1989 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Aug 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A liquid heat- and light-sensitive resinous composition which contains as main components (A) a photopolymerizable compound prepared by reacting a novolak type epoxy compound with successively, an unsaturated monocarboxylic acid represented by at least one of formula (I) and (II) and a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerizable compound having at least one ethylenic unsaturated double bond, (C) an epoxy compound having at least one epoxy group, (D) a photopolymerization initiator, (E) a thermosetting catalysts capable of making an epoxy group undergo a thermal reaction, and (F) an organic solvent; ##STR1## wherein R represents -H or -CH.sub.3 ; R.sup.1, R.sup.2 and R.sup.3 each represents an unsubstituted or substituted alkylene group, an unsubstituted or substituted arylene group, or an unsubstituted or substituted aralkylene group; and X represents -COO-, -OCO- or -O-. The composition exhibits photo- and thermocurability, developability with an alkaline aqueous solution and ability to form a permanent protective mask for printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.