Reinforced thermoplastic molding materials based on polyphenylene ether

US4948832A · kind A · utility

Assignee

• BASF SE

Inventors

• Bertram Ostermayer · Bad Dürkheim, DE
• Ehrenfried Baumgartner · Bad Dürkheim, DE
• Rainer Bueschl · Bad Dürkheim, DE
• Hermann Brandt · Neustadt, DE
• Klaus Boehlke
• Erhard Seiler · Ludwigshafen, DE
• Graham E. McKee · Ludwigshafen, DE

Key dates

• Filing date: Dec 9, 1988
• Grant date: Aug 14, 1990
• Expiry date: Dec 9, 2008

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Reinforced thermoplastic molding materials containing, as essential components, PA1 (A) from 40 to 94 parts by weight of a polymer component of PA2 (a.sub.1) from 10 to 90% by weight of polyphenylene ether and PA2 (a.sub.2) from 10 to 90% by weight, based in each case on A, of a styrene polymer toughened with an acrylate rubber or with an unhydrogenated or hydrogenated polymer of a conjugated diene, PA1 (B) from 1 to 20 parts by weight of a copolymer of PA2 (b.sub.1) from 70 to 99.9% by weight of a monomer from the group consisting of styrene, .alpha.-methylstyrene and styrene alkylated in the nucleus or a mixture of these monomers, PA2 (b.sub.2) from 0.1 to 30% by weight of one or more compounds from the group consisting of tert-butyl acrylate and tert-butyl methacrylate, or one or more compounds from the group of compounds of the general formula I ##STR1## where R.sup.1 is hydrogen or methyl and R.sup.2, R.sup.3 and R.sup.4 are each an alkyl or alkoxy group of not more than 4 carbon atoms, or of the general formula II ##STR2## where n is an integer from 1 to 4 and R.sup.5, R.sup.6 and R.sup.7 are each one of the radicals stated for R.sup.2 or are each --O(CH.sub.2 --CH.sub.2 --O)…