Semiconductor device
US4949160A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 1988 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Dec 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a plurality of inner leads substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet arranged on the pellet mounting area so as to adhesively fix inner lead tip portions, and a semiconductor pellet mounted on the insulating sheet, wherein each tip portion of at least every other inner lead is provided with a broader portion broader than the width of each of the other inner lead tip portions, the broader portion is positioned closer to the central portion of the lead frame than the other inner lead tip portions, and an opening or a thin portion is provided within the broader portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.