Test socket for electronic device packages
US4950980A · kind A · utility
Inventor
Key dates
| Filing date | Jul 29, 1988 |
| Grant date | Aug 21, 1990 |
| Priority date | — |
| Expiry date | Jul 29, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0433
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A socket having an array of terminals adapted for insertion into a burn-in board is adapted to interconnect respective pins of a high pin density integrated circuit package to the terminals. The socket includes a lid with an array of holes for receiving the pins and registering the pins with underlying terminal openings and a cam mechanism actuable to move the lid relative to the terminals to cause the pins to make contact with the terminals within the openings. Mounting of the package on the socket and insertion of the pins into underlying terminal openings is accomplished with zero insertion force applied to the pins. Actuation of the cam mechanism causes the pins to contact respective terminals without deforming the pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.