Impedance matched plug-in package for high speed microwave integrated circuits
US4951011A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1986 |
| Grant date | Aug 21, 1990 |
| Priority date | — |
| Expiry date | Jul 24, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The metallic header through which the pin/glass interfaces extend is provided with a ridge adjacent to the end of a respective pin. This increase in thickness of the header surrounding each glass-embedded center pin provides a prescribed capacitive reactance component for compensating the inductive reactance of the interiorly extending segment of the center pin and any connecting lead through which the microwave integrated component is coupled to the pin. In a second embodiment, the thickness of insulator glass that surrounds the center conductor is less than the thickness of the header.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.