Method of mounting electronic components
US4951388A · kind A · utility
36Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1989 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Jun 20, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting electronic components, comprising steps of: sucking an electronic component by a suction nozzle provided at the tip of a mounting head; holding the sucked electronic component in position by a centering device having an opening and closing mechanism and provided separately from the mounting head, and while holding the component applying adhesive to a side of the electronic component, the side being opposite to that sucked onto the suction nozzle; and mounting the electronic component to a designated position on a printed circuit board. The nozzles on the head are of different sizes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.