Electroplating process
US4952286A · kind A · utility
25Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1988 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Feb 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/92
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.