Heat-shrinkable envelope
US4952438A · kind A · utility
7Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1988 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Jul 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24785
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-shrinkable envelope that is composed of a shrinkable component and a reinforcing component having a metallic matrix. The strength is increased on the basis of the metallic matrix and the ability to tear or, respectively, to continue to tear is considerably reduced. In addition, the metallic matrix forms an electrical and/or magnetic shield for components wrapped in the envelope.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.