Patent · US Expired

Heat-shrinkable envelope

US4952438A · kind A · utility

7Cited by
10References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 8, 1988
Grant dateAug 28, 1990
Priority date
Expiry dateJul 8, 2008

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24785
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A heat-shrinkable envelope that is composed of a shrinkable component and a reinforcing component having a metallic matrix. The strength is increased on the basis of the metallic matrix and the ability to tear or, respectively, to continue to tear is considerably reduced. In addition, the metallic matrix forms an electrical and/or magnetic shield for components wrapped in the envelope.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.