Bonding composition for ceramics comprising metal oxide melt and method for bonding ceramics
US4952454A · kind A · utility
12Cited by
10References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 16, 1988 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Jun 16, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12618
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A bonding composition comprising a metal oxide melt comprising (a) CaO, (b) SiO.sub.2 and/or Al.sub.2 O.sub.3, and (c) a metal oxide selected from TiO.sub.2, ZrO.sub.2, Cr.sub.2 O.sub.3, HfO.sub.2, Nb.sub.2 O.sub.3 and Ta.sub.2 O.sub.5 is melt-bonded on the surface of a ceramic material, and the ceramic material is bonded to an adherend, if necessary through at least one layer selected from a plating layer, a solder layer, and a buffer layer. In this manner, a strong bonding can be very easily obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.