Photosensitive resin composition
US4952481A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1988 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Dec 27, 2008 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA63F2009/2476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is hereby provided a photosensitive resin composition suitable for a relief printing plate having an excellent resistance to a water based ink, whereby water or a water like solvent can be employed as a developing solution, which comprises; PA1 (i) a polymer (A) having a molecular weight of 5,000 to 500,000 which contains an amino group and a polymerizable double bond moiety, PA1 (ii) a monomer (B) having an .alpha.,.beta.-ethylenically unsaturated bond and a free acid group which can quaternize the nitrogen atom of the polymer (A), PA1 (iii) a photopolymerizable unsaturated compound (C), and PA1 (iv) a photopolymerization initiator (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.