Method of coupling a terminal to a thick film circuit board
US4952529A · kind A · utility
20Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 1988 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Sep 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thick film integrated circuit having a terminal with a plurality of parallel legs each having an angled foot portion for connection to the thick film circuit board. An elongated tie bar extends perpendicular to the legs and connects the legs to each other for stabilization. The tie bar has sufficient mass and is positioned sufficiently far from the foot so that heat can be applied to the foot to solder it to the thick film substrate. The legs are positioned in a guide bar with tapered sides to provide a self-centering feature when the terminal is coupled to a connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.