Patent · US Expired

Heat distortion resistant, transparent thermoplastic molding material, its preparation and its use

US4952654A · kind A · utility

2Cited by

1References

6Claims

0Family size

Assignee

BASF SE

Inventors

Rainer Bueschl · Bad Dürkheim, DE
Adolf Echte · Ludwigshafen, DE
Juergen Mertes · Ingelheim am Rhein, DE

Key dates

Filing date	Mar 16, 1989
Grant date	Aug 28, 1990
Priority date	—
Expiry date	Mar 16, 2009

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08F220/54
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A heat distortion resistant, transparent thermoplastic molding material contains a copolymer of the monomers PA0 (a) methyl methacrylate and PA0 (b) an N-substituted amide of methacrylic acid. The molding material contains from 5 to 95% by weight of monomer (a) and from 95 to 5% by weight of monomer or monomers (b), the percentages being based on (a)+(b), and furthermore, as monomer (b), and N-substituted amide of the formula ##STR1## where R is a primary, secondary or tertiary alkyl radical, cycloalkyl, aryl or aralkyl of 2 to 12 carbon atoms. The molding material is used for the production of heat distortion resistant moldings or laminates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.