Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US4953058A · kind A · utility
66Cited by
4References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 1, 1989 |
| Grant date | Aug 28, 1990 |
| Priority date | — |
| Expiry date | Sep 1, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular segment that is adapted to receive heat generating electronic assemblies therewithin. The modular segments may be joined together to form a housing and the electronic assemblies are electrically interconnected through a hollow channel provided in the joined modular segments. The segments are configured with fins and ribs that form air channels on all vertical outer surfaces of the segments to promote cooling by convective air flow through the channels and between the segments. Segments may be added to form a housing with expanded capacity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.