Patent · US Expired

Pendulum with bending spring joint

US4953834A · kind A · utility

24Cited by

12References

4Claims

0Family size

Assignee

LITEF GmbH · DE

Inventors

Wolfram Ebert · Glückstadt, DE
Eberhard Handrich · Kirchzarten, DE
Martin Hafen · Colmar, FR
Bruno Ryrko · Denzlingen, DE

Key dates

Filing date	Jan 20, 1988
Grant date	Sep 4, 1990
Priority date	—
Expiry date	Jan 20, 2008

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF16C11/12
WIPO fieldMechanical elements
WIPO sectorMechanical engineering

Abstract

A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.