Chemical deposition of copper from alkaline aqueous baths
US4954369A · kind A · utility
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2References
3Claims
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Key dates
| Filing date | Feb 21, 1989 |
| Grant date | Sep 4, 1990 |
| Priority date | — |
| Expiry date | Feb 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper is chemically deposited from alkaline aqueous baths containing polyacetal complexing agents obtainable by reacting PA1 (a) dialdehydes of the formula ##STR1## and n is 0 or 1, with (b) polyolcarboxylic acids which contain 2 or more OH groups and have from 4 to 7 carbon atoms in a molar ratio of (a):(b) of from 1:0.5 to 1:3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.