Perforated glue through films
US4954383A · kind A · utility
15Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1988 |
| Grant date | Sep 4, 1990 |
| Priority date | — |
| Expiry date | Jul 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Metallized plastic sheet film products improved by being perforated through their surfaces are disclosed. These sheet products can be incorporated into improved strength composites since their perforations permit glue through and prevent delamination and shear previously observed with metallized plastic sheet film products. In addition, the perforations can be used to adjust the conductivity/resistance of the electrically conductive sheet films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.