Semiconductor wafer array with electrically conductive compliant material
US4954875A · kind A · utility
169Cited by
27References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 1987 |
| Grant date | Sep 4, 1990 |
| Priority date | — |
| Expiry date | Oct 28, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01019
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer array comprising a plurality of wafers of semiconductor material. Each of the wafers is provided with cone-shaped or pyramid-shaped vias. Inserted in each of the vias is a correspondingly shaped wad of electrically conductive compliant material for forming continuous vertical electrical connections between the wafers in the stack. The base of each wad makes connection to a bonding pad on the surface of a lower wafer as well as to the electrically conductive compliant material in the lower wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.