Interconnection of electronic components
US4955523A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1988 |
| Grant date | Sep 11, 1990 |
| Priority date | — |
| Expiry date | Feb 1, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.