Plasma conditioning of a substrate for electroless plating
US4956197A · kind A · utility
9Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1988 |
| Grant date | Sep 11, 1990 |
| Priority date | — |
| Expiry date | Sep 30, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The conditioning can be in the holes and/or on the surfaces of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.