Bonding method employing sprayable hot melt adhesives for case and carton sealing
US4956207A · kind A · utility
29Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1988 |
| Grant date | Sep 11, 1990 |
| Priority date | — |
| Expiry date | Nov 14, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Rigid substrates for case and carton sealing and traymaking applications are bonded by spray application of a hot melt adhesive composition comprising 25 to 50 percent of an isotactic thermoplastic polybutene-1/ethylene copolymer containing from about 5.5 to about 10% by weight ethylene; 20 to 60 percent of a tackifier; 15 to 30 percent of an amorphous diluent having a softening point greater than 90.degree. C.; 0 to 2 percent antioxidant; and 0 to 10 percent wax or oil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.