Method and apparatus for plastic injection molding/encapsulation
US4957670A · kind A · utility
3Cited by
1References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 30, 1990 |
| Grant date | Sep 18, 1990 |
| Priority date | — |
| Expiry date | Jan 30, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/842
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A plastic injection molding/encapsulation apparatus for the peripheral encapsulation of a glass workpiece which is equipped with an optical sensing device including a light source, a light detector, and a light reflector to detect possible glass breakage of the workpiece and thus automatically shutting down the plastic injection process to avoid damage to the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.