Hot embossing plates crosslinkable by photopolymerization
US4957852A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1988 |
| Grant date | Sep 18, 1990 |
| Priority date | — |
| Expiry date | Jun 10, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/033
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In hot embossing plates which are crosslinkable by photopolymerization and comprise PA0 (a) a heat-stable, dimensionally stable base and PA0 (b) a relief-forming layer which is crosslinkable by photopolymerization and soluble or dispersible in water and contains PA1 (b.sub.1) one or more partially or virtually completely hydrolyzed polyvinyl alkanecarboxylates as binders, PA1 (b.sub.2) one or more alkenecarbonylamino-N-methylene ethers of polyhydric alcohols as photopolymerizable monomers and PA1 (b.sub.3) photopolymerization initiators, the relief-forming layer (b) contains, as further binders (b.sub.1), PA1 (b.sub.11) alkenecarboxylates and/or alkenecarbonylamino-N-methylene ethers of partially or virtually completely hydrolyzed polyvinyl alkanecarboxylates and/or PA1 (b.sub.12) alkenecarboxylates and/or alkenecarbonylamino-N-methylene ethers of partially or virtually completely hydrolyzed graft copolymers of vinyl alkanecarboxylates and alkylene oxides, and is more than 0.8 mm thick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.