Encapsulating compositions
US4957960A · kind A · utility
4Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1990 |
| Grant date | Sep 18, 1990 |
| Priority date | — |
| Expiry date | Jan 30, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/549
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An encapsulating composition for electronic devices comprises a curable material such as a silicone resin and an ion scavenger compound selected from certain calixarene or oxacalixarene compounds in which at least half of the phenolic groups have been substituted by specific groups and certain silacrown compounds. Exemplary ion scavenger compounds include ##STR1## the tetraethyl acetate of 7, 13, 19, 25-tetra-tertbutyl-27, 28, 29, 30-tetrahydroxy-2,3-dihomo-3-oxacalix-4-arene and 1,1-dimethasila-17-crown-6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.