High profile shrink package
US4958480A · kind A · utility
11Cited by
6References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 1, 1989 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | Sep 1, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B11/50
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The present invention involves a method of packaging a product including drawing a thermoplastic thermoformable web into a thermoforming mold to form a cavity, inserting the product into the cavity, moving the web and product to a vacuum chamber, placing a tray, upside down, in the chamber on top of the web to define an unsealed package; sealing the tray to the web under vacuum; and shrinking the bottom web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.