Ultrasonic wire bonder
US4958762A · kind A · utility
20Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1989 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | Aug 25, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20303
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic wire bonder includes first and second ultrasonic wave applying devices, the direction of vibration of the first ultrasonic wave being orthogonal to that of the second ultrasonic wave. One of the first and second ultrasonic waves or a composite ultrasonic wave thereof is applied to a capillary and/or a support base for wire bonding, depending upon the bonding direction along which a wire is extended, or the inner lead longitudinal direction. A unit for detecting the positions of a semiconductor chip and lead frame may be provided to adjust a position and control the ultrasonic wave to be applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.