Tin whisker-free tin or tin alloy plated article and coating technique thereof
US4959278A · kind A · utility
73Cited by
11References
82Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1989 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | Jun 8, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin or tin alloy plated article, particularly a film carrier which is protected against the generation of tin whiskers characterized in having an indium plated layer on the substrate thereof and a tin or tin alloy plated layer on said indium plated layer. There are also disclosed a coating process therefor as well as a novel and unique electroless indium plating bath therefor, said indium plating bath is an acidic, electroless plating bath characterized by including an indium salt and thiourea or a derivative thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.