Epoxy resin composition and prepreg for composite materials using the same from bi and tri-epoxides, triarylbisphenols and diaminodiphenylsulfones
US4959438A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1989 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | Jan 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition is disclosed, which comprises the following elements: PA0 (A) a bifunctional epoxy resin; PA0 (B) a trifunctional epoxy resin; PA0 (C) a phenolic compound represented by the following general formula: ##STR1## wherein X.sub.1, X.sub.2, X.sub.3, X.sub.4, X.sub.5, X.sub.6, X.sub.7, X.sub.8, X.sub.9, X.sub.10, X.sub.11, X.sub.12, R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or a methyl group; and PA0 (D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone, wherein the molar ratio of epoxy groups in element (A) to those in element (B) is in the range of from 1/4.0 to 1/0.1, element (C) is used in an amount that satisfies the condition: EQU 1/0.9.ltoreq.(A+B)/C.ltoreq.1/0.1 and element (D) is used in an amount that satisfies the condition: EQU 1/1.3.ltoreq.(A+B-C)/D.ltoreq.1/0.8 wherein A represents the number of epoxy groups by moles in element (A), B represents the number of epoxy groups by moles in element (B), C represents the number of phenolic hydroxyl groups by moles in element (C), and D represents the number of NH groups by moles in element (D). A prepreg for composite materials is…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.