Metalized film capacitor and method of manufacturing the same
US4959652A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1989 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | Aug 30, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A metalized film capacitor according to the present invention includes a capacitor element obtained by winding or stacking metalized films, solder layers respectively formed on outermost layers on both end faces of the capacitor element, and a coating resin which coats the capacitor element. Exposed electrodes of the capacitor are obtained by polishing and removing the coating resin from the solder layers to entirely or partially expose the solder layers. The melting point of the exposed electrode is slightly higher than that of a surface-mounting solder, and therefore good soldered portions can be obtained without causing fusing or deformation of the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.