Mounting of electronic microcomponents on a support
US4959900A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1989 |
| Grant date | Oct 2, 1990 |
| Priority date | — |
| Expiry date | Jul 17, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For flat mounting of electronic microcomponents, such as chip carriers, on a printed circuit support, the electrical contacts of the microcomponent are connected to pads on the printed circuit, microcomponents having solderable contacts on a lower face thereof, comprising electrically connecting said solderable contacts of the microcomponent to respective pads on the printed circuit through sections of flexible wires having a sufficient degree of curvature for mechanically uncoupling said microcomponents from said printed circuit support and mechanically connecting the microcomponent to the support through a spacer having planar dimensions lower than planar dimensions of a base of said microcomponent for providing access to said contacts for connecting said sections thereto. An intermediate product includes the chip carrier and a grid conencted to the lower face thereof, including connecting sections and an edge strip connecting the external ends of all sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.