Automatic wafer mounting device
US4960485A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1988 |
| Grant date | Oct 2, 1990 |
| Priority date | — |
| Expiry date | May 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer mounting device for automatically adhering wafers individually on a polishing plate surface for polishing the surface of the wafers. The wafers are stacked in a wafer cassette and are taken out from the wafer cassette one-by-one, and transferred to an adhesive coating section of the device by a wafer carrying means. The surface of each of the wafers is coated with an adhesive wax in a coating section. Afterward the adhesive coated wafers are carried out from the coating section by the carrying means. The wafers are taken out from the carrying means and the surfaces thereof are reversed by a reverse chuck means. The polishing plate is disposed in a position automatically where the reversed wafers arrive, and the wafers are automatically adhered onto the surface of the polishing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.