Laser interconnect process
US4960613A · kind A · utility
20Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1988 |
| Grant date | Oct 2, 1990 |
| Priority date | — |
| Expiry date | Oct 4, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The uniformity of a catalyst layer produced by laser decomposition of a catalyst source compound is substantially improved for patterned substrates whose characteristics vary along the path of a conductor line by providing a buffer layer of a metal such as Ti, Cr or Ni over the substrate prior to the laser induced decomposition of the catalyst source compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.