Method of forming an interconnection by an excimer laser
US4961259A · kind A · utility
32Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1989 |
| Grant date | Oct 9, 1990 |
| Priority date | — |
| Expiry date | Jun 16, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A raised metal connection feature (29) is created by forming a conductive pad (17) on a flexible substrate (11) and applying a flexible dielectric insulator (19) and photoresist layer (21) over the conductive pad (17). An excimer laser (25) is used to ablate a via (27) through the dielectric insulator (19) and photoresist (21) to the conductive pad (17). Gold or other metal is then plated up in the via (17), and the photoresist (21) is removed, leaving a metal feature (29) extending above the dielectric insulator (19).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.