Methods for bonding optical fibers to wafers
US4961768A · kind A · utility
10Cited by
7References
10Claims
0Family size
Inventor
Key dates
| Filing date | Apr 20, 1989 |
| Grant date | Oct 9, 1990 |
| Priority date | — |
| Expiry date | Apr 20, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4212
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods for bonding transparent materials to opaque materials. The materials to be bonded are placed in tightly abutting relation to one another, and an energetic laser pulse is directed through the transparent material until it melts a thin surface layer of the opaque material. The desired bond is formed when the melted layer solidifies. In alternative embodiments the transparent material is precoated with various mediator materials to facilitate the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.