IC card
US4962415A · kind A · utility
78Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1990 |
| Grant date | Oct 9, 1990 |
| Priority date | — |
| Expiry date | Feb 6, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing plate are formed integrally in a thin plate-like module which is well-fitted in the above-mentioned opening while the external contact terminals on the film substrate are exposed externally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.