Expansion injection molding die
US4963087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1989 |
| Grant date | Oct 16, 1990 |
| Priority date | — |
| Expiry date | Apr 27, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/4015
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An expansion injection molding die having a plate forming the die cavity, a backup plate, a core plate, ejector pins inserted through the backup plate and the core plate for separating the molded products from the die cavity, and a gas introducing passage communicating with the pressurized gas source for introducing gas into the die cavity. The plate that has holes through which the ejector pins are injected are formed with hollow portions. In each of the hollow portions, a guide ring is installed so that it is freely movable at least two-dimensionally. A sealing member is installed in an expanded hole portion in the guide ring so that it is in sliding contact with the ejector pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.