Integrated electrical conducting, cooling and clamping assembly for power semiconductors
US4963976A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1988 |
| Grant date | Oct 16, 1990 |
| Priority date | — |
| Expiry date | Sep 12, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple phase electronic semiconductor package 10 including a stack of electrically conductive plates 12 with two opposed clamping plates 14, at least one interposed semiconductor component 16 and two side plates 18 flanking the stack. The height of the side plates 18 is a predetermined amount less than the combined height of the conductive plates 12 and semiconductor components 16. Threaded fasteners 20 secure the opposed clamping plates 14 to the side plates 18 causing the opposed clamping plates 14 to abut the side plates 18, and thereby creating a specific clamping force between the conductive plates 12 and semiconductor components 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.