Three dimensional before stack depth migration of two dimensional or three dimensional seismic data
US4964103A · kind A · utility
33Cited by
9References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1989 |
| Grant date | Oct 16, 1990 |
| Priority date | — |
| Expiry date | Jul 13, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V1/301
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a three dimensional before stack depth migration of two dimensional or three dimensional seismic data. Ray tracing is used to move before stack trace segments to their approximate three dimensional position. The trace segments are scaled to depth, binned, stacked and compared to the model. The model can then be changed to match the depth trace segments which will be stacked better, moved closer to their correct three dimensional position and will compare better to the model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.