Process for producing electrical connections through a substrate
US4964212A · kind A · utility
189Cited by
5References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 8, 1989 |
| Grant date | Oct 23, 1990 |
| Priority date | — |
| Expiry date | Sep 8, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the invention, blind holes (27) and not through-holes are produced. For this purpose, the substrate (10) to be pierced or perforated is previously covered with a layer (12) less absorbing for the laser perforating beam (26) than the substrate. Application to the production of electronic circuits, magnetic recording devices, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.