Electroplating apparatus
US4964964A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Oct 23, 1990 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating rack is constructed of corrosion resistant stainless steel, with oppposed side frames milled with vertical channels to accommodate opposite side edge portions of a printed circuit board for plating. Mechanical and electrical connections with the circuit board are made with recessed stainless steel screws with rounded tips. Current is provided to the top of the rack, and also to the bottom of each side frame through an elongate, vertically disposed copper bar surrounded by an insulative sheath and contained within each side frame. Each of the copper rods is threadedly engaged in a steel end cap at the bottom of the associated frame. The current fed into the top and bottom of the rack can be adjusted by adjusting the comparative conductivity of the two paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.